[HFW Relay] open
AI summary
This tender provides details about the project including scope of work, estimated value, deadlines, and eligibility requirements.
Overview
The Semi-Conductor Laboratory (SCL) has published a tender for the supply of HFW Relay. This is a single-stage tender aimed at procuring electronic components and devices. The tender is open for bids from 20-Apr-2026 until 19-May-2026, with the bid opening scheduled for 20-May-2026.
Scope / Work
The work involves the supply of HFW Relay, with detailed specifications provided in the tender documents. Bidders are required to comply with the technical specifications and commercial terms outlined in the tender. The location for the work is the Semi Conductor Laboratory, Pincode: 160071.
Fees & EMD
There are no tender fees or EMD (Earnest Money Deposit) required for this tender, which may encourage broader participation. However, bidders should note that no exemptions for fees or EMD are allowed.
Key dates
- Published Date: 20-Apr-2026 01:00 PM
- Bid Submission Start Date: 20-Apr-2026 01:00 PM
- Bid Submission End Date: 19-May-2026 11:00 AM
- Bid Opening Date: 20-May-2026 12:00 PM
- Document Download Start Date: 20-Apr-2026 01:00 PM
- Document Download End Date: 19-May-2026 11:00 AM
- Clarification Start Date: 20-Apr-2026 01:00 PM
- Clarification End Date: 23-Apr-2026 10:00 AM
Bidders are encouraged to download the tender documents promptly and participate in the clarification period to ensure all queries are addressed before submission.
AI insights
Risk factors
- tight timelines for bid submission
- no EMD or fee exemptions
- compliance with technical specifications required
- single-stage bidding process
Financials
| Tender value | Undisclosed |
|---|---|
| EMD amount | โน0.00 โ payable to Nil at Nil |
| Tender fee | โน0.00 โ payable to Nil at Nil |
Timeline
| Publish date | 20-Apr-2026 01:00 PM |
|---|---|
| Bid end | 19-May-2026 11:00 AM |
| Opening date | 20-May-2026 12:00 PM |
Critical dates
From the portal detail page (all dates captured when available).
| Bid Opening Date | 20-May-2026 12:00 PM |
|---|---|
| Bid Submission End Date | 19-May-2026 11:00 AM |
| Bid Submission Start Date | 20-Apr-2026 01:00 PM |
| Clarification End Date | 23-Apr-2026 10:00 AM |
| Clarification Start Date | 20-Apr-2026 01:00 PM |
| Document Download / Sale End Date | 19-May-2026 11:00 AM |
| Document Download / Sale Start Date | 20-Apr-2026 01:00 PM |
| Published Date | 20-Apr-2026 01:00 PM |
Tender Documents
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| Name | Size | Type | Action |
|---|---|---|---|
| BOQ_952161.xls | 289.5 KB | XLS |
Corrigenda
Official amendments and notices. PDFs open in the same viewer as tender documents (sign in, verified email, daily limit applies).
Bid Auto Extn Corrigendum
No PDF files attached to this corrigendum row.
Work details
Location, category, and schedule for this procurement.
| Location | Semi Conductor Laboratory |
|---|---|
| Category | Electronic Components And Devices |
| Bid validity | 120 days |
Tender basics
| Tender type | Single |
|---|---|
| Form of contract | Supply |
| Tender category | Goods |
| No. of covers | 2 |
| Organisation chain | Semi-Conductor Laboratory (SCL) |
| Source portal | eprocure.gov.in |
Covers (bid packets)
What to submit in each cover, as listed on the tender portal.
| Cover no. | Cover type | Description | Document type |
|---|---|---|---|
| 1 | Fee/PreQual/Technical | Tender Acceptance Letter | |
| โ | โ | Compliance to commercial Terms and Conditions | |
| โ | โ | Compliance to Technical Specifications (Annexure-A) | |
| 2 | Finance | BOQ duly signed stamped and scanned copy | |
| โ | โ | BOQ | .xls |
Authority details
| Inviting authority | Naresh Singh, PSO |
|---|---|
| Address | Semi Conductor Laboratory |
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